Magnesium Compounds for Heat emission fillers

Characteristics

Plastics are widely used in the electric and electronic component fields, taking advantage of light weight, rust- resistance, shape design flexibility, etc.
In general, plastic materials have excellent heat and electrical insulation, but they are disadvantageous in that their heat conductivity is as low as approx. 0.1-0.3 W/m.K.

The downsizing and high integration trends have been progressing in recent years with electric and electronic components such as semiconductor devices, ICs and LSIs, yet the heat generated in equipment is accumulated in the plastics and cannot be released to outside. Therefore, product design has been restricted in some cases.

Measures against such heat generation, such as ways to quickly remove the heat generated from a circuit, are extremely important tasks that require solutions, and fillers that have both electrical insulation and high heat conductivity are required in semiconductor sealing resins and heat radiating sheet.
Silicon oxide SiO2 and aluminum oxide Al2O3 are generally used as heat emission fillers, while magnesium oxide MgO, boron nitride BN and aluminum nitride AlN, which have higher heat conductivity, are under study for such use. However, they all have the drawbacks shown in the table below and have not yet been approved for multipurpose use.

All of the pure magnesium anhydrides (magnesite) that have been successfully synthesized by our company, the magnesium oxide of improved water resistance and the magnesium hydroxide of improved acid resistance are used as multipurpose fillers because they are safe to human health and can be supplied at a low price. Their application as high heat emission fillers is expected.

Comparison of Properties
Chemical
Formulation
True
Specific
Gravity
Thermal
Conductivity
W/m.K
Mohs
Hardness
Weak Point
Magnesium Oxide MgO 3.6 45-60 6 Low Acid Resistance and
Low Water Resistance
Synthetic Magnesite MgCO3 3.0 15 3.5
Magnesium Hydroxide Mg(OH)2 2.4 8 2.5 Low Acid Resistance
Fused Silica SiO2 2.6 2 6 Low Thermal Conductivity
Alumina Al2O3 3.9 20-35 9 High Hardness
Hexagonal Boron Nitride BN 2.3 30-50 2 High Price
Aluminum Nitride AlN 3.2 150-250 7 High Hardness and High Price
Performance comparison between our sample product and commercially available fillers
Thermal
Conductivity
Mohs
Hardness
Water
Resistance
Acid
Resistance
Price
Test sample of
Konoshima
Magnesium Oxide
(Treated for water resistance)
B C C C B
Synthetic Magnesite B- B A B B
Magnesium Hydroxide
(Treated for acid resistance)
C A A C B
Commercially
Available Fillers
Fused Silica D C A A B
Alumina B- D A A C
Hexagonal Boron Nitride B A B B D
Aluminum Nitride A C D D D

A:Best, B:Good, C:Normal, D:Bad

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